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Curing AdhesiveUV Moisture Dual
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Curing AdhesiveUV Moisture Dual
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: 16.11.2022
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Name
UV Moisture Dual Curing Adhesive
E-Mail:
uvmoisture@gmail.com
Geburtsdatum
19. Mai 1995
Homepage
https://www.deepmaterialcn.com/uv-moisture-dual-curing-adhesive.html
Wohnort
Huizhou
Registriert am:
16.11.2022
Beschreibung
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C. Website:
https://www.deepmaterialcn.com/uv-moistu...g-adhesive.html
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