Camera Module Assembly
| Zuletzt Online: 28.10.2022
Name
AssemblyCamera Module
E-Mail:
assemblycemeramodule@gmail.com
Geburtsdatum
19. Mai 1995
Wohnort
Huizhou
Registriert am:
28.10.2022
Beschreibung
In the field of electronics, adhesives are used in particular for cell phone and smartphone camera modules. This includes the bonding of individual components—such as lens-to-lens mount or lens mount-to-camera sensor—, securing camera chips to circuit boards (die attach), using adhesive as chip underfill, Low pass bond the filter and glue the assembled camera module into the device housing.
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